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- 📢 Gate Square #Creator Campaign Phase 2# is officially live!
Join the ZKWASM event series, share your insights, and win a share of 4,000 $ZKWASM!
As a pioneer in zk-based public chains, ZKWASM is now being prominently promoted on the Gate platform!
Three major campaigns are launching simultaneously: Launchpool subscription, CandyDrop airdrop, and Alpha exclusive trading — don’t miss out!
🎨 Campaign 1: Post on Gate Square and win content rewards
📅 Time: July 25, 22:00 – July 29, 22:00 (UTC+8)
📌 How to participate:
Post original content (at least 100 words) on Gate Square related to
- 📢 Gate Square #MBG Posting Challenge# is Live— Post for MBG Rewards!
Want a share of 1,000 MBG? Get involved now—show your insights and real participation to become an MBG promoter!
💰 20 top posts will each win 50 MBG!
How to Participate:
1️⃣ Research the MBG project
Share your in-depth views on MBG’s fundamentals, community governance, development goals, and tokenomics, etc.
2️⃣ Join and share your real experience
Take part in MBG activities (CandyDrop, Launchpool, or spot trading), and post your screenshots, earnings, or step-by-step tutorials. Content can include profits, beginner-friendl
- 🎉 Gate Square’s "Spark Program" Surpasses 1,000 KOLs!
💥 The creator ecosystem is in full bloom!
📈 Get featured, earn rewards, and grow your influence—what are you waiting for?
💰 Cash incentives ✔️
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👑 Exclusive verification ✔️
From 0 to 1,000 in just weeks—Gate Square is becoming the epicenter of Web3 content! ⚡
You’re not just posting content, but the next "viral opportunity"!
🌟 Join the Spark Program and kickstart your breakthrough!
👉 https://www.gate.com/announcements/article/45695
Yongxie Electronics DiFEM module packaging technology breaks through ultra-thin size
Jinshi Data, February 17, according to Yongsi electronic news, DiFEM module, as an important form of RF front-end modularization, can realize the reception and processing of multiple signals by integrating RF switches and filters, which can reduce the size while improving integration and performance to meet the needs of mobile intelligent terminal products. The innovation of DiFEM module packaging technology is one of the key factors driving the performance improvement of communication equipment. Yongsi Electronics has made a breakthrough in the field of DiFEM module packaging, using FCLGA packaging technology to highly integrate RF switches and multiple filter chips to achieve ultra-thin package size.